Signal Integrity
Signal propagation through board, package and interconnects is analyzed, making visible the sources of signal degradation:

• Impedance variation from trace discontinuities
• Coupling between adjacent signal lines
• Resonance of power, signal, and ground structures
• Spurious mode generation

The results are displayed in 3 dimensional field plots, s-parameters and extracted RLC parameters

EMI
Shielding enclosures for high speed digital designs are modeled:

• Identify energy coupling mechanisms that cause slots and apertures to degrade performance
• Calculate radiated energy from a device

Component Characterization
Simulation of novel designs and advanced structures allows for faster and more accurate prototyping:

• Antennas ,waveguides, coax/waveguide transitions, connectors, hybrid couplers, directional couplers, dielectric resonators, spiral inductors, cavities...